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DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
M3D281
KMI15/2 Integrated rotational speed sensor
Product specification Supersedes data of 2000 Jun 26 2000 Sep 05
Philips Semiconductors
Product specification
Integrated rotational speed sensor
FEATURES * Digital current output signal * Zero speed capability * Wide air gap * Wide temperature range * Insensitive to vibration * EMC resistant. DESCRIPTION
handbook, halfpage
KMI15/2
PINNING PIN 1 2 VCC V- DESCRIPTION
The KMI15/2 sensor detects (rotational) speed and reference mark detection of magnetized targets(1). The sensor consists of a magnetoresistive sensor element, a signal conditioning integrated circuit in bipolar technology and a magnetized ferrite magnet. The frequency of the digital current output signal is proportional to the rotational speed of a gear wheel. CAUTION Do not press two or more products together against their magnetic forces.
(1) The sensor contains a customized integrated circuit. Usage in hydraulic brake systems and in systems with active brake control is forbidden. For all other applications, higher temperature versions of up to 150 C are available on request.
1 2
MBH780
Fig.1 Simplified outline; (SOT453A).
QUICK REFERENCE DATA SYMBOL VCC ICC (low) ICC (high) ft Tamb PARAMETER DC supply voltage current output signal low current output signal high operating frequency ambient operating temperature 0.5 - - 0 -40 MIN. 12 7 14 - - TYP. 16 - - 25000 +85 MAX. V mA mA Hz C UNIT
2000 Sep 05
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Philips Semiconductors
Product specification
Integrated rotational speed sensor
LIMITING VALUES In accordance with Absolute Maximum Rating System (IEC 60134). SYMBOL VCC Tstg Tamb Tsld PARAMETER DC supply voltage storage temperature operating ambient temperature soldering temperature output short-circuit duration to GND CHARACTERISTICS Tamb = 25 C; VCC = 12 V; ft = 2 kHz; test circuit: see Fig.7; RL = 115 . SYMBOL ICC (low) ICC (high) tr tf td ft HsLH HsHL Hs PARAMETER current output signal low current output signal high output signal rise time output signal fall time switching delay time operating frequency magnetic switching field strength magnetic switching field strength magnetic switching hysteresis see Fig.6 see Fig.6 CL = 100 pF; 10 to 90% value CL = 100 pF; 10 to 90% value between stimulation pulse (generated by a coil) and output signal for both rotation directions CONDITIONS MIN. 5.6 11.2 - - - 0 0.05 0.05 0.15 TYP. 7.0 14.0 0.5 0.7 1 - 0.3 0.3 - t 10 s CONDITIONS Tamb = -40 to +85 C; RL = 115 MIN. 0.5 -40 -40 -
KMI15/2
MAX. 16 +150 +85 260
UNIT V C C C
continuous
MAX. 8.4 16.8 - - - 25000 0.8 0.8 1.6
UNIT mA mA s s s Hz kA/m kA/m kA/m
2000 Sep 05
3
Philips Semiconductors
Product specification
Integrated rotational speed sensor
FUNCTIONAL DESCRIPTION The KMI15/2 sensor is sensitive to magnetic fields. The functional principle is shown in Fig.3. The field lines of a magnetized target are shown in Fig.3 as a straight target (it could also be circular e.g. for rotational speed measurement). If a sensor KMI15/2 is moved as shown in this field, either of the magnetic field components HsHL or HsLH is dominant, and forces the sensor to switch to either the high current (14 mA) or to the low current (7 mA). Oscillation of the sensor output signal is avoided by the implementation of a hysteresis into the signal conditioning electronic. The MR sensor is stabilized by a permanent magnet applying a continuous magnetic field of 6 kA/m to the sensor. If the magnetic field given by the magnetized target errors like frequency doubling might occur. The magnetoresistive sensor element signal is amplified, temperature compensated and forwarded to a Schmitt-trigger in the conditioning integrated circuit (Figs 4 and 5). The digital output signal levels (Fig.6) are independent of the magnetic field condition. A (2-wire) output current enables safe transfer of the sensor signal to the detecting circuit (Fig.7). The integrated circuit housing is separated from the sensor element housing to optimize the sensor behaviour at high temperatures.
handbook, halfpage
KMI15/2
x magnet with direction of magnetization
x z
y
sensor
IC
MBH777
Fig.2 Component detail of the KMI15/2.
2000 Sep 05
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Philips Semiconductors
Product specification
Integrated rotational speed sensor
KMI15/2
handbook, full pagewidth
moving direction of the sensor
HSHL
HSLH
magnetized target 14 mA 7 mA
N
SS
NN
SS
NN
S
output signal
MGD808
Fig.3 Functional principle of KMI15/2.
handbook, full pagewidth
VOLTAGE CONTROL
CONSTANT CURRENT SOURCE
V CC
SENSOR
AMPLIFIER
SCHMITT TRIGGER
SWITCHABLE CURRENT SOURCE
V
MRA958
Fig.4 Block diagram.
2000 Sep 05
5
Philips Semiconductors
Product specification
Integrated rotational speed sensor
KMI15/2
handbook, full pagewidth
VCC switchable current source constant current source
sensor
power supply
EMC FILTER preamplifier Schmitttrigger
Vref GAP
V
MRA959
Fig.5 Simplified circuit diagram.
handbook, halfpage
MRA960
I CC T 14 mA V CC SENSOR 7 mA tp V I CC RL CL GND t
MRA961
tp = --- x 100% T
Fig.6 Output signal as a function of time.
Fig.7 Test and application circuit.
2000 Sep 05
6
Philips Semiconductors
Product specification
Integrated rotational speed sensor
PACKAGE OUTLINE Plastic single-ended multi-chip package; magnetized ferrite magnet (3.8 x 2 x 0.8 mm); 4 interconnections; 2 in-line leads
HE1 E A L1 M2 bp1 D2 D vMAB L3 L B A Q
KMI15/2
SOT453A
E1
SENSOR DIE POSITION centre of reading point D1
HE
*
L2 1 bp e M1 M3 2 c
vMAB K 0 2.5 scale 5 mm
DIMENSIONS (mm are the original dimensions) UNIT A(1) mm 1.7 1.4 bp 0.8 0.7 bp1 1.57 1.47 c 0.3 0.24 D(2) D1(2) D2(2) E(2) E1(2) 4.1 3.9 5.7 5.5 3.15 2.95 4.5 4.3 5.7 5.5 e 4.6 4.4 HE 18.2 17.8 HE1 5.6 5.5 K max. 1.67 L 7.55 7.25 L1 1.2 0.9 L2 3.9 3.5 L3 6.55 6.35 M1 3.9 3.7 M2 M3(1) 2.1 1.9 0.9 0.7 Q v
0.75 0.25 0.65
Notes 1. Glue thickness not included. 2. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT453A REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 99-09-22 00-08-31
2000 Sep 05
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Philips Semiconductors
Product specification
Integrated rotational speed sensor
DATA SHEET STATUS DATA SHEET STATUS Objective specification PRODUCT STATUS Development DEFINITIONS (1)
KMI15/2
This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
Preliminary specification
Qualification
Product specification
Production
Note 1. Please consult the most recently issued data sheet before initiating or completing a design. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2000 Sep 05
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Philips Semiconductors
Product specification
Integrated rotational speed sensor
NOTES
KMI15/2
2000 Sep 05
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Philips Semiconductors
Product specification
Integrated rotational speed sensor
NOTES
KMI15/2
2000 Sep 05
10
Philips Semiconductors
Product specification
Integrated rotational speed sensor
NOTES
KMI15/2
2000 Sep 05
11
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For all other countries apply to: Philips Semiconductors, Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 2000
Internet: http://www.semiconductors.philips.com
SCA 70
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613520/04/pp12
Date of release: 2000
Sep 05
Document order number:
9397 750 07469

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